ROHS (Directive 2002/95/EC) Exemptions List

LIST OF ROHS (Directive 2002/95/EC) EXEMPTIONS (AT 29/07/2009)

Exemptions for RoHS: The RoHS Directive (2002/95/EC) bans new electrical and electronic equipment destined to EU market containing more than the permitted levels of Lead, Cadmium, Mercury, Chromium VI, PBB and PBDE. Exemptions, periodically amended,are established due to technical developments.

1. Mercury in compact fluorescent lamps not exceeding 5 mg per lamp.
Directive 2002/95/EC

2. Mercury in straight fluorescent lamps for general purposes not exceeding:
— halophosphate 10 mg
— triphosphate with normal lifetime 5 mg
— triphosphate with long lifetime 8 mg.
Directive 2002/95/EC

3. Mercury in straight fluorescent lamps for special purposes.
Directive 2002/95/EC

4. Mercury in other lamps not specifically mentioned in this Annex.
Directive 2002/95/EC

5. Lead in glass of cathode ray tubes, electronic components and fluorescent tubes.
Directive 2002/95/EC

6. Lead as an alloying element in steel containing up to 0,35 % lead by weight, aluminium containing up to 0,4 % lead by weight and as a copper alloy containing up to 4 % lead by weight.
Directive 2002/95/EC

7. -Lead in high melting temperature type solders (i.e. lead-based alloys containing 85 % by weight or more lead),
-lead in solders for servers, storage and storage array systems, network infrastructure equipment for switching, signalling, transmission as well as network management for telecommunications,
- lead in electronic ceramic parts (e.g. piezoelectronic devices).
Decision 2005/747/EC

8. Cadmium and its compounds in electrical contacts and cadmium plating except for applications banned under Directive 91/338/EEC amending Directive 76/769/EEC relating to restrictions on the marketing and use of certain dangerous substances and preparations. Decision 2005/747/EC

9. Hexavalent chromium as an anti-corrosion of the carbon steel cooling system in absorption refrigerators.
Directive 2002/95/EC

WITHDRAWN 9a. DecaBDE in polymeric applications
This exemption has been cancelled by the European Court of Justice on 1 April 2008 with an enforcement date of 1 July 2008.
Decision 2005/717/EC ECJ

9b. Lead in lead-bronze bearing shells and bushes.
Decision 2005/717/EC

11. Lead used in compliant pin connector systems.
Decision 2005/747/EC

12. Lead as a coating material for the thermal conduction module c-ring.
Decision 2005/747/EC

13. Lead and cadmium in optical and filter glass.
Decision 2005/747/EC

14. Lead in solders consisting of more than two elements for the connection between the pins and the package of microprocessors with a lead content of more than 80 % and less than 85 % by weight.
Decision 2005/747/EC

15. Lead in solders to complete a viable electrical connection between semiconductor die and carrier within integrated circuit Flip Chip packages.
Decision 2005/747/EC

16. Lead in linear incandescent lamps with silicate coated tubes.
Decision 2006/310/EC

17. Lead halide as radiant agent in High Intensity Discharge (HID) lamps used for professional reprography applications.
Decision 2006/310/EC

18. Lead as activator in the fluorescent powder (1 % lead by weight or less) of discharge lamps when used as sun tanning lamps containing phosphors such as BSP (BaSi2O5:Pb) as well as when used as speciality lamps for diazo-printing reprography, lithography, insect traps, photochemical and curing processes containing phosphors such as SMS ((Sr, Ba)2MgSi2O7:Pb).
Decision 2006/310/EC

19. Lead with PbBiSn-Hg and PbInSn-Hg in specific compositions as main amalgam and with PbSn-Hg as auxiliary amalgam in very compact Energy Saving Lamps (ESL).
Decision 2006/310/EC

20. Lead oxide in glass used for bonding front and rear substrates of flat fluorescent lamps used for Liquid Crystal Displays (LCD).
Decision 2006/310/EC

21. Lead and cadmium in printing inks for the application of enamels on borosilicate glass.
Decision 2006/691/EC

22. Lead as impurity in RIG (rare earth iron garnet) Faraday rotators used for fibre optic communications systems until 31 December 2009.
Decision 2006/691/EC
Decision 2009/428/EC

23. Lead in finishes of fine pitch components other than connectors with a pitch of 0.65 mm or less with NiFe lead frames and lead in finishes of fine pitch components other than connectors with a pitch of 0.65 mm or less with copper lead frames.
Decision 2006/691/EC

24. Lead in solders for the soldering to machined through hole discoidal and planar array ceramic multilayer capacitors.
Decision 2006/691/EC

25. Lead oxide in plasma display panels (PDP) and surface conduction electron emitter displays (SED) used in structural elements; notably in the front and rear glass dielectric layer, the bus electrode, the black stripe, the address electrode, the barrier ribs, the seal frit and frit ring as well as in print pastes.
Decision 2006/691/EC

26. Lead oxide in the glass envelope of Black Light Blue (BLB) lamps.
Decision 2006/691/EC

27. Lead alloys as solder for transducers used in high-powered (designated to operate for several hours at acoustic power levels of 125 dB SPL and above) loudspeakers.
Decision 2006/691/EC

28. Hexavalent chromium in corrosion preventive coatings of unpainted metal sheetings and fasteners used for corrosion protection and Electromagnetic Interference Shielding in equipment falling under category three of Directive 2002/96/EC (IT and telecommunications equipment). (Exemption granted until 1 July 2007.)
Decision 2006/692/EC

29. Lead bound in crystal glass as defined in Annex I (Categories 1, 2, 3 and 4) of Council Directive 69/493/EEC.
Decision 2006/690/EC

30. Cadmium alloys as electrical/mechanical solder joints to electrical conductors located directly on the voice coil in transducers used in high-powered loudspeakers with sound pressure levels of 100 dB (A) and more.
Decision 2008/385/EC

31. Lead in soldering materials in mercury free flat fluorescent lamps (which e.g. are used for liquid crystal displays, design or industrial lighting).
Decision 2008/385/EC

32. Lead oxide in seal frit used for making window assemblies for Argon and Krypton laser tubes.
Decision 2008/385/EC

33. Lead in solders for the soldering of thin copper wires of 100 μm diameters and less in power transformers.
Decision 2009/443/EC

34. Lead in cement-based trimmer potentiometer elements.
Decision 2009/443/EC

35. Cadmium in photo resistors for opt couplers applied in professional audio equipment until 31 December 2009.

Decision 2009/443/EC

36.Mercury used as a cathode sputtering inhibitor in DC plasma displays with a content up to 30 mg per display until 1 July 2010.

Decision 2009/443/EC

37. Lead in the plating layer of high voltage diodes on the basis of a zinc borate glass body.

Decision 2009/443/EC

38. Cadmium and cadmium oxide in thick film pastes used on aluminium bonded beryllium oxide.
Decision 2009/443/EC

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